EIPEKSOFFICIAL member of RPG for 0 years

Our company boasts a state-of-the-art optoelectronic hybrid integrated device packaging and testing center, occupying an area of over 700 square meters, with an internal Class 10,000 cleanroom spanning approximately 300 square meters. We possess advanced micrometer-level technology, enabling precise assembly and processing of optoelectronic hybrid devices, including bonding, eutectic welding, chip adhesion, coupling, and sealing processes.

Our laboratory is fully equipped to conduct comprehensive inspections, identification, testing, grading, and secure storage of quantum core devices and their related products, ensuring product quality. Additionally, we have two SMT production lines, two DIP production lines, and one three-proof coating production line, providing the capability to execute system-level surface mounting, through-hole soldering, three-proof coating, screening, complete machine assembly and debugging, testing, and verification, among other production tasks.